产品优势：

·优良高频电学特性

·大尺寸玻璃易于获取

·工艺流程简单，不需沉积绝缘层

·机械稳定性强且翘曲小

·应用广泛：射频组件、光电集成、MEMS

玻璃通孔三维集成 · 2.5D TGV Interposer

TGV Interposer Process Capability

TGV Via filling SEM (Cu)   

TGV Interposer SEM   

Advantages：

·Excellent high frequency electrical characteristics

·Easy to obtain large-size glass

·Simpler process flow，no need to deposit insulation layer

·Strong mechanical stability with lower warpage

·Be widely used in：RF devices、Optical Electronic、MEMS

2.5D TGV Interposer

2.5D TGV Interposer · CPO Option 

EIC/PIC 2.5D CPO  

产品优势：

·传输损耗低

·小尺寸和高集成度

·成本优势

Advantages：

·Low transmission loss

·Small size and high integration

·Cost advantage

TGV interposer performance at 100Ghz, with -3db loss