短流程工艺能力 · Short Loop Process

·具备4/6/8/12寸化镀NiAu/NiPDAu能力

·With 4/6/8/12 inch NiAu/NiPDAu E-less plating capability

CD 20um/pitch 20um

CD 20um/pitch 30um

  CD 120 um/Pitch 240 um

CD 150 um/Pitch 300 um

化镀 Electroless Plating

Electroless Plating Process Capability

化镀应用介绍

Application of Electroless