产品优势：

·超快激光技术      ·可实现深宽比100:1的玻璃通孔

·广泛应用在MEMS、射频通信、生物医疗等领域

玻璃通孔 · TGV

TGV Process Capability

 Advantages：

·Ultrafast laser technology    ·the aspect ratio of TGV can reach 100:1

·Be widely used in MEMS、RF communication、biomedical and other fields

Through  Glass Wafer

Via Effects & aperture

Through Via 500:10

 Blind Via

Through Via

  Blind Via

TGV